Measuring the thermal expansion of ultra thin samples

Abstract

Measuring the thermomechanical behavior of ultra-thin materials has always been a challenge due to the low mechanical strength of very thin sheets. Even when reducing the force applied by the push rod of a standard electronic dilatometer to a minimum, it is nearly impossible to get a reliable measurement on sheets with a thickness below 100 microns because they bend too easily. Recently, a new instrument* has been introduced specifically for measuring the thermal expansion of ultra-thin materials. The instrument can carry out thermomechanical measurements without making any contact with the sample, providing extremely accurate results. Additionally, the test procedure is designed to be easy and hassle-free, with no need to run calibration curves.

Publication
Ceramic Industry

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